Sputtering Targets
Sputtering is one of the most commonly used thin film deposition to deposit thin film of different materials, in the form of sputtering targets, (Deposition Table Material) on the various substrates. The characteristics of sputter targets play an important great role in the quality of the deposited thin film and the performance of the sputtering process.
Target Material
Sputtering Targets may consist of only one element, alloys or compounds. The purity and stoichiometric characteristics of the target materials has a key impact on the proper performance of the deposited thin film for various applications.
- Metal targets: used to make a heat or electrical conductive coatings on a surface, typically made of pure elements like gold, silver, copper, aluminum, and titanium. Also. Tungsten and Iridium are used for sample preparation for high-resolution electron microscopy.
Note: When using ferromagnetic target notice if magnetron sputtering is employed. In magnetron sputtering a magnetic field is induced by the magnets behind the cathode, which enhances the sputtering rate. However, the thickness of the ferromagnetic targets should be very low (less than 0.1 mm) to maintain an efficient magnetic field over the target surface.
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- Ceramic (Semi-conductive) targets: used to produce hard, wear-resistant, and chemically stable surfaces, where ceramics like SiO2, Al2O3, and TiO2 are typically utilized.
Note: Ceramic are so brittle and have a low heat conductivity. So it is strongly recommended to avoid damages cracking, bending, etc., to the target using a backing plate (bonding).
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- Alloy targets: made up of a combination of 2 or more metals to achieve tailored properties.
- Composite targets: manufactured by combining 2 or more material of different types, like a metal and a ceramic, for specific applications.
Note: For low melting point target materials, temperature sensitive compounds, low density and fragile target materials; elastomer bonding is recommended.
Target Shapes and Dimensions
Sputtering targets’ dimension and shapes can be different due to the deposition system in use. Planar and rotatable targets are widely used for different applications. Planar sputter targets also exist in the form of circular and rectangular targets. Different shapes and dimensions of the targets result in different plasma characterization and coating uniformities.
Vac Coat sputtering deposition systems use planar circular targets for better control over plasma uniformity for research purposes. Our popular Sputter Coaters are DSR1, DST1-170/300, DST2-TG and DST3 are able to sputter 1 to 3 sputter targets to make a thin film of a pure or composite material.
Vac Coat large single cathode sputter coaters, models DSCR-300 and DST1-300, a 2, 3, or 4 inches diameter cathode and corresponding target can be installed based on the purchase order. Larger targets enhance coating uniformity on larger substrates.
Sputter Targets Maintenance and Handling Tips
To extend the lifespan and performance of sputtering targets:
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- Storage: Keep in a clean, dry environment.
- Handling: Use clean gloves and tools to prevent contamination.
- Regular Inspection: Check for cracks, pits, or wear.
- Cleaning: Remove buildup or debris to maintain efficiency.
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Vac Coat’s Target series is ISO9001 certified and includes targets consistings of elements, alloys and compounds with high purity and precision stoichiometry. Bonding service for targets comprise of ceramics and fragile materials is also provided by the company upon customer request.
Vac Coat sputtering cathodes are typically installed on the chamber’s head. This requires to fix the target on the cathode when screwing the target holder. Vac Coat Mag Target FastenerTM is a magnetic accessory which helps to fix the target at the center of the cathode while screwing the target holder.
