Products
Sputter Coater and Thermal Evaporator – DST3-T
for enhanced productivity and multilayer deposition
High-vacuum Triple-target System
The DST3-T is a triple-target turbomolecular-pumped multi vacuum-coating system that combines thermal evaporator and sputter coater in one single compact desktop system. The high vacuum system is suitable for deposition of a wide range of materials. The triple magnetron target desk sputter coater can easily switch between evaporation and sputtering condition (Not simultaneously).
The DST3-T is equipped with a large chamber (300 mm diameter) and three 2” diameter water-cooled cathodes which make it suitable for long time sputter deposition. The magnetron desk sputter coater is equipped with RF and DC power supplies. It can sputter semiconductors, dielectrics, and metal (Oxidizing and noble) targets.
The DST3-T sputter coating system with RF power supply is equipped with an auto adjustable matching box, minimizing the reflected power in the RF sputtering process. This model, DST3-T, contains optional features to increase coated film adhesion to the substrate and improve the film structure, such as a 500 ˚C heater to be installed to heat the substrate during the deposition process, or a 300 V DC bias voltage can be applied to the substrate.
According to state of the cathodes, DST3-T is available in two models:
- DST3 – TA (Angled Cathodes):
The DST3-TA is equipped with three angled cathodes with a common focal point. The sputter coater system can sputter from two or three (Optional) targets simultaneously or independently to form alloys or multilayer deposition, respectively. The maximum size of substrates in this model could be 3 inches.
- DST3 –TS (Straight Cathodes):
DST3-TS with three straight 2-inch water-cooled cathodes is suitable for sputtering a single large specimen with diameter up to 20 cm or several small specimens.
- High vacuum level with built-in turbo pump
- Two-stage rotary vane backing pump (Diaphragm and scroll pump)
- DC and RF (Optional) power supplies suitable for metals, semiconductors, and dielectrics
- Three 2” water-cooled angled, magnetron cathodes suitable for producing alloy films (DST3-TA) and multilayer deposition
- Large sample holder stage (8 inches) for DST3-TS
- Cathode mask designed for large substrate uniform deposition (DST3-TS)
- Two fixed and movable quartz crystal monitoring systems for real time thickness measurement (1 nm precision)
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Gas injection control through two precision Mass Flow meters (MFC) for fine control of vacuum pressure and Ar flow or reactive sputtering gas
- Full range vacuum gauge
- Cathode selection motor
- Sample rotation, height, and tilt adjustable (For 3-inch sample holders)
- Three manual or electronic (Optional) shutters
- One thermal source holder
- Two-year warranty
- CE conformity
- Vac Coat products are covered worldwide by both public and product Liability Insurance in case any property damage or personal injury happens caused by the Vac Coat systems.
- Intuitive touch screen to control the coating process and rapid data input
- User friendly software, updatable via network
- Semi-full automatic timed or thickness coating process (Optional)
- Repeatable and programmable sputtering process in the automatic mode
- DC/RF/High-current deposition parameters adjustable though the touch screen panel (Optional)
- Records and plots coating parameters graphs
- Automated cathode selection
- Metal, semiconductor, and dielectric films
- Nano and microelectronic
- Solar cell applications
- Co-Sputtering processes
- Glad sputtering
- Optical components coating
- Thin film sensors
- Magnetic thin film devices
- Fine grain structural deposition for SEM and FE-SEM sample preparation
- Turbo molecular pump with different pumping speeds (Optional):
| Pumping Speed | 90 l/s | 250 l/s | 350 l/s |
| Ultimate Pressure | 8×10-6 Torr | 3×10-6 Torr | 8×10-7 Torr |
- Independent sputtering control rate for each cathode to produce fine grain structures
- Unlimited deposition time without breaking the vacuum
- Maximum 6 mm target thickness (Including backing plate)
- Automatic control of deposition power independent of pressure
- Automatic control of the cathode’s temperatures to protect the life time of the magnets
- Electronic throttle valve for 350 l/s turbo pump
- Records and plots coating parameters graphs
- Deposition process curves and data transfer by a USB port to PC
- 0-1200 V, 0-500 mA DC power supply
- 300 W RF power supply with automatic matching box (Optional)
- 0-24 V, 0-100 A high-current power supply
- Water-cooled high-current electric feedthroughs
- Utilities: 220 V – 110 V, 50/60 HZ
- Max. consuming power: 3 kW
- Dimensions: 770 H x 600 W x 800 D mm (Without Rack)
- Weight: 160 kg (Pump, rack, and instrument case)
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- Quartz crystal sensors
- Spare glass chamber
- Sputtering targets
- Sealing gaskets
- Thermal source materials
- 300 V DC bias voltage
- Plasma cleaner
- 500 ˚C substrate heater
- RF power supply and matching box for deposition of conductive and non-conducting targets
- Plasma cleaner
- 300 V DC substrate bias voltage
- 500 ° C programmable substrate heater with software control
Thermal Evaporation
The DST3-T is equipped with a high current power supply and low-voltage (Resistive) thermal evaporation platform suitable for a wide variety of thermal evaporation applications. The sputter coating system allows controlled thermal evaporation of wide range materials onto the substrate. Different types of thermal evaporation sources (Boat, basket, and coil) can be installed on the single thermal source holder.
Clean Vacuum
The vacuum chamber of DST3-T is Cylindrical Pyrex with 300 mm OD and 200 mm H (Adjustable to 250 mm H). The DST3-T is fitted with an internally mounted turbomolecular pump, backed by a 6 m3/h two-stage rotary vane pump (Optional). It introduces a clean vacuum without oil contamination which normally exists with an ordinary diffusion pump.
Touch Screen Control
DST3-T is equipped with a 7” colored touch screen panel using user-friendly software to control and adjust the deposition process data. The vacuum and coating sequence information can be observed as digital data or curves on the touch screen and the last 300 coatings are saved on the history page.
- Dimensions: 420 × 480 × 370 mm (H × W × D)
- Weight: 30 Kg
- Vacuum Chamber Dimension: Borosilicate Glass, 170 mm Dia. × 140 mm Height
- Display Screen: 7” Diagonal (16:9) 800 × 480 High Color- Graphic TFT- LCD
- Data Transfer: USB Port – For Transferring the data and graph to PC
- Target Dimension: 1 Disc, Diameter ranging 50-56 mm, Thickness 0.1~3 mm (The preferred Thickness is less than 1 mm)
- Sample Holder Dimension:
- Standard holder with 60 mm Dia., can contain:
- 23 × 9.6 mm stubs or
- 14 × 12.7 mm stubs or
- 5 × 19 mm stubs
- Sample holder with 100 mm Dia. with Offset gear box can contain 40 × 12.7 mm stubs (Optional)
- Standard holder with 60 mm Dia., can contain:
- Chamber’s Lid: Made of Aluminum and can locate 1 Cathode on it
- Specification: Crystal thickness gauge with sensor, gold coated crystal quartz, oscillator
- Resolution: ±1 Angstrom
- Accuracy: ±1 Nanometer
- Vacuum Pump: Two-stage rotary vane
- Vacuum Gauge Range: 1 × 103 – 1 × 10-3 Torr
- Final Vacuum: 30 × 10-3 Torr
- Sputtering: Continuous Sputtering, Time, and Thickness dependent
- Gas: Argon as a carrier gas with %99.999 purity
- Electric Power Supply: DC: 80 W switching DC power supply
- Control of Argon supply: Electronic leak valve
- Electrical Inlet: Inlet: 220-240 V, 50/60 Hz; or 110 V, 50/60 Hz *
* Single-phase AC power with appropriate earth connection is required.
Sample Holder
The sample holder stage is made in two sizes, of microscope slides, 3 inches (Available in DST3-TA and DST3-TS) and 8 inches (Available in DST3-TS), but the user can order customized size according to their needs. Several S-clamps are created on the small sample holders to hold the small samples with a simple method during the rotation.
Plasma Treatment (Plasma Cleaner Option)
The triple target sputter coater – DST3-T can be equipped to plasma cleaner as an option. Plasma treatment/cleaning is the process of removing organic matter from the surface of substrate or functionalizing it through the use of an ionized gas called plasma. Plasma treatment can modify the wettability of the substrate surface and enhance its hydrophilicity or hydrophobicity for effective subsequent depositions. Also, applying plasma to the substrate before thin film deposition eliminates surface contaminations (C-based, Oxides) and improves the adhesion between the substrate and the subsequent layers.
