
Bias Sputtering
[vc_row][vc_column width="3/4"][vc_row_inner][vc_column_inner width="1/2"][vc_column_text css=""] Bias Sputtering Bias sputtering, or substrate biasing, involves applying an electric voltage to the substrate, which increases the ion bombardment of the substrate and the subsequent coating during the sputter deposition process. The main aim of substrate bias sputtering is to minimise film contamination by the process gas atoms, and it helps produce more condensed films with lower electrical resistivity compared to those formed without substrate biasing. [/vc_column_text][/vc_column_inner][vc_column_inner width="1/2"][vc_single_image image="13636" img_size="medium" add_caption="yes" alignment="center" style="vc_box_outline" border_color="mulled_wine" css=""][/vc_column_inner][/vc_row_inner][vc_row_inner css=".vc_custom_1758448637471{background-color: #D9D9D9 !important;}"][vc_column_inner][vc_column_text css=""] How Does Substrate Bias Sputtering Work? During the sputtering process, the surface of the sputtering target is bombarded by the positive ions generated in the plasma of the process gas. The substrate ion bombardment can be controlled by adjusting the applied voltage, which can modify the…