Reactive sputtering is a kind of sputter deposition, introducing reactive gases throughout the coating process to produce thin films of compounds with tailored features.

Coating the samples with the proper material is typically an essential step in sample preparation for electron microscopy imaging like SEM, FESEM, and TEM.

Reactive sputtering is a kind of sputter deposition, introducing reactive gases throughout the coating process to produce thin films of compounds with tailored features. Reactive sputter deposition has various applications in production of energy storage devices, hard and decorative coatings, and microelectronics.

Rotary vacuum pumps are positive displacement pumps that are widely used in different industries, pharmaceutical processes, vacuum coating systems, etc., to provide a mid-range vacuum environment.

DC-diode sputtering is a common method for deposition of conductive materials, typically used in EM sample preparation and electrical contact coating.

The physical Vapor Deposition (PVD) market will grow significantly in the coming years due to the increasing global demand for complex electronic devices, green energy, medical coatings, etc., especially in Asia as the semiconductor manufacturing hub.

Magnetron sputtering is a key technique that enhances the conventional sputtering process by increasing both the sputtering and deposition rates at lower chamber pressures.

Chemical vapor deposition (CVD) is a coating method for thin film deposition through chemical processes in a reactor with precursors, and has numerous applications in electronics, semiconductors, optoelectronics, and advanced materials research.

Vacuum feedthroughs are essential components in a vacuum chamber. Electrical feedthrough, especially high-current feedthroughs should be provided regarding safety precautions.

RF sputtering is widely used for electrically non-conductive target materials deposition.

The sputter target surface undergoes erosion by successive collisions of the energetic charged particles through the magnetron sputtering process. The erosion pattern plays an important role in the sputter target lifetime or target utility;