ISSP2026
The 18th International Symposium on Sputtering & Plasma Processes (ISSP2026) will be held from June 30 to July 3, 2026, at Kyoto Research Park, Kyoto, Japan.
The ISSP 2026 is organized by the Japan Society of Vacuum and Surface Science (JVSS), to bring together the engineers and researchers from all over the world working on the field of sputtering and plasma processes.
The conference will consist of several sessions, including the most trend topics in thin film deposition techniques and applications, plasma physics and sputter coating:
- Fundamentals of Sputtering and Plasma Physics
- Sputtering and Plasma Smart Process Technologies
- Pulsed Sputtering and HiPIMS
- Fundamentals of Thin Films Growth
- Functional Thin Films and Advanced Coatings
- Applied Research and Industrial Applications
